为奥特斯及其客户实现可持续创新
电子工业的特点是持续快速发展并且经常有技术突破。奥特斯的客户是有各行各业的一流企业。他们希望我们的产品和工艺符合高标准，并具有足够的灵活性，以跟上行业快速创新的步伐。
我们重视研发，所以坚持不懈地开发我们的技术，确保客户的想法能尽快落地。自奥特斯成立以来，我们已经证明大胆投入研发必有回报。同时，我们也高度重视可持续发展概念，并利用新技术减少我们集团以及我们的合作伙伴公司的环境足迹。
无论是在技术、业务流程还是实施环境改善方面，从最初的想法到执行，创新都是推动奥特斯前进的动力。我们正在为塑造一个互联互通的未来作出重要的贡献。
研发总监Hannes Voraberger
更快、更绿色、更好的互联
我们不遗余力地积极打造未来技术，提供创新解决方案解决客户的技术问题。毕竟，只有这样才能在竞争中先行一步，继续在微电子革命中发挥关键作用，并为解决我们社会面临的重大挑战作出重要贡献。同时，强大的电子系统正推动经济数字化和脱碳进程，为实现低成本、灵活控制各种系统开辟了道路：例如，风力发电厂依靠智能控制才能高效运转。强大的计算机、服务器和移动设备中使用的微芯片也是如此。
奥特斯技术应用于处理器，并实现微芯片与计算机中其它必备元件之间的通信。
我们的印制电路板（PCB）和半导体封装载板不仅可以确保快速处理数据，还通过进一步微型化真正地大幅降低能耗。奥特斯在环境责任方面以严格的标准要求自己以及我们的供应商，始终确保我们的技术进步不以牺牲环境为代价。我们以全局思维看待未来的世界。我们秉承全面的可持续生产理念，不断升级完善，促使我们使用更环保的材料和更节能的基础设施。我们积极主动地确保我们拥有一个不断进步并适于居住和生活的未来。
研发助力
为了保持我们在技术和环保责任方面的领先地位，我们将10%的收入投入新产品和新工艺的研发。目前，这相当于每年投入约1.554 亿欧元。我们在奥地利的工厂从这项投资中受益匪浅，已经有一大批先进的技术准备投产。
奥特斯 在高科技印制电路板（PCB）和半导体封装载板的生产制造方面拥有800多项专利。这些创新产品和技术是我们收入的重要贡献者，它们经过数年的研发，在投入市场三年后，为我们带来25,9%的收入。
新研发中心：奥地利和欧洲其它地区的高科技
未来几年，奥特斯计划投资5亿欧元在利奥本新建一个研发中心，该研发中心将雇佣700名新员工。
到2025年，奥特斯位于利奥本的总部将新建一个研发中心和配套生产工厂。新大楼的建设将耗资约5亿欧元，研发中心和生产工厂的面积超过1万平方米。这将总共创造700个新的工作岗位。
新的研发中心标志着奥特斯集团对持续技术开发和利奥本生产基地的承诺。这里将见证许多新产品和新想法的诞生，继续为奥特斯走向光明的未来保驾护航。新的研发中心还将为利奥本带来半导体封装载板生产方面的专业知识，使奥地利能够再次吸引高科技电子和半导体行业的精英人才。
这是欧洲地区的一个灯塔项目，因为它将是欧洲大陆一个半导体封装载板生产工厂。目前，半导体封装载板及移动设备事业部占奥特斯总销售额的近四分之三，随着利奥本生产基地的扩张，该事业部的贡献将更加明显。
数据、数据、数据
电子工业蓬勃发展的核心是数据革命，近年来，数据革命彻底改变了行业和我们的日常生活。记录、储存和分析的数据与日俱增，目的是让我们能够尽可能高效地处理流程，以及访问各种各样的在线服务。这些发展需要数据处理系统不仅能耗低还可以高效地传输信号，同时仍然允许高度的复杂性。无论在汽车行业、医疗技术还是半导体生产中，微电子系统的设计者和制造商都可以利用奥特斯的印制电路板（PCB）和半导体封装载板来满足这些要求。
通过持续的技术开发，我们确保电路板在能源消耗和信号传输效率方面处于重要地位。
我们与客户合作开发和优化我们的产品，而且现在是在一个完全数字化的环境中进行协作。
这不仅可以简化改进工作，还更便于实施减少环境影响的措施。我们与我们的供应商和业务合作伙伴都使用这一方法，因此我们可以共同帮助确定整个生产生态系统的优先事务。我们努力以尽可能微型化的微电子系统实现低资源消耗，确保高效处理数据，信号线高速节能。
科研机构与工业伙伴
通过与一些著名的科研机构合作，我们一直处于行业的技术前沿，其中包括德国的弗劳恩霍夫研究所（Fraunhofer Institute），格拉茨技术大学（Graz University of Technology）、利奥本矿业大学（Montanuniversität Leoben）、Silicon Austria Labs、印度理工学院和美国弗吉尼亚理工大学等。通过大力投资以及与优秀的研究伙伴合作，我们不断巩固我们的技术专家地位，并推动电子行业未来的技术突破。
促进科研：奥特斯项目和合作
作为一家创新型高科技公司，奥特斯是奥地利乃至整个欧洲科研领域的重要一员。高质量的研发工作让我们获得了著名资助项目的资金支持，并有机会与众多国际知名的合作伙伴合作。欲了解更多信息，请点击此处：
IPCEI on Microelectronics & Communication Technologies (IPCEI ME/CT)
The IPCEI ME/CT concerns research and development projects covering microelectronics and communication technologies along the entire value chain, from materials and tools to chip designs and manufacturing processes.
These projects aim to enable the digital and green transformation by
- creating innovative microelectronics and communication solutions and
- developing energy-saving and resource-efficient electronic systems and manufacturing methods.
They will contribute to the technological advancement of important industry sectors, including communications (5G and 6G), autonomous driving, artificial intelligence and quantum computing. They will also actively support companies in their green transitions by facilitating the sustainable generation, distribution and use of energy.
IPCEI ME/CT succeeds and complements the first IPCEI, which has already been completed successfully, by supporting research and innovation in the field of microelectronics.
The project was jointly prepared and announced by fourteen Member States: Austria, Czechia, Finland, France, Germany, Greece, Ireland, Italy, Malta, the Netherlands, Poland, Romania, Slovakia and Spain.
AT&S – Part of IPCEI ME/CT
AT&S aims to strengthen its position in the value creation chain and to enter new and demanding fields of expertise by establishing a R&D line and a prototyping and small volume line for advanced IC Substrates and packaging technologies. The new facilities will create a world-class competence center for organic IC Substrates and highly integrated modules.
With this project, AT&S is addressing the following overall objectives pertaining to the work stream THINK – work package 2 Semiconducter Technologies, smart manufacturing.
- Modeling the future
Virtual development & system understanding for European technology leadership - Miniaturization
Features on Substrate level capable of routing 2nm node processors - Flexible Manufacturing
Speed up development cycles and realize small volumes - Die Integration
Increase power efficiency on system level
AT&S focuses on establishing and ramping up a smart and sustainable
- R&D line for of advanced fan-out, IC-substrate and packaging technologies, targeting new generations of IC Substrates with up to 6x higher wiring density.
- Prototyping and small volume line for IC-Substrates and packaging technology.
- Competence centre for the industrial development of advanced fan-out, IC-Substrates and packaging technologies to utilize the competences for interaction and collaboration with different partners.
AT&S IPCEI ME/CT spill over activities include the following:
Industry collaboration & Research co-operations
Induced by IPCEI ME/CT, AT&S will support and strengthen development activities across Europe along the value chain and with universities and RTOs. With these activities, we create positive spill- over effects for Europe.
Strengthen education and talents & sharing know-how
AT&S will foster the involvement of universities in the area of Science, Technology, Engineering and Mathematics and make the knowledge available to partners (SMEs, universities and RTOs).
Horizon Europe – MIcroelectronics RELiability driven by Artificial Intelligence (MIRELAI)
MIRELAI is an EU-funded Industrial Doctoral Network with the ambition to address the challenges reliability, sustainability, and verification efforts related to the production of microelectronics components, and boost Europe’s innovation capacity and competitiveness in the market.
To achieve this goal, the project recruited 13 doctoral candidates (DCs) to investigate the physics of degradation and reduce testing and verification efforts across the value chain of electronic components and systems, while providing invaluable skills to the next generation of engineers.
SHIFT is an European funded Project with the Goal to develop an innovative transceiver prototype enabling future generation mobile devices to utilize the wide spectrum beyond 100GHz efficiently and effectively.
SHIFT will develop a technology design platform for the new SiGe BiCMOS technology and integration concepts. The platform can be used to design commercial MMIC´s for very high frequencies (telecommunication, health, instrumentation, smart mobility, robotics, industry) up to 200GHz.
Concept:
- Application (Specification on system, TX/RX, circuits)
- Design: B55X circuit design, PA design, RF interposer design
- TX/RX Integration (RF interposer/PCB)
- TRX system development and validation
CHIPS JU – Heterogeneous Integration for Connectivity and Sustainability (HiConnects)
HiConnects is an European funded Project with the Goal to develop innovative panel level packaging technologies with high level integration of advanced heterogeneous photonic and RF components, based on Embedding.
Development of structuring and integration processes for future IC substrates and non-destructive testing of suitable process and metrology equipment development.
Develop the optical integration of next generation smart-NIC and switch platforms with higher bandwidth and lower energy consumption.
Develop the integration of RF Components for 77 GhZ & 144 GhZ Automotive Radar.
MICROELEctronic 2 market – InnoPower
This project is a development in the field of embedding, which means the integration of semiconductor components into a printed circuit board (“Process Flow Center Core Embedding”).
In this specific case, it involves the production of a DC/DC converter that converts a DC input voltage (DC) into a DC output voltage (DC = Direct Current). In order to produce such a DC/DC converter, both driver and SFET (Semiconductor Field-Effect Transistor) components are integrated into a small area on a printed circuit board in order to achieve a package that can be used in the field of “artificial intelligence”. By integrating the semiconductor components, a significant reduction in the size of the DC/DC converters can be achieved. Compared to “state of the art” products, a size reduction of > 50% can be achieved.
Innovationscamps M – DeCarb
Empowering enterprises towards zero carbon from science to action
The DeCarb Project funded by the FFG (Österreichische Forschungsförderungsgesellschaft) has the goal to strengthen the competitiveness and securing the location of companies through a know-how lead in decarbonization. Furthermore, a best practice community of climate pioneers who act as multipliers is established.
Horizon Europe – Packaging of Ultra-Dynamic Photonic Switches and Transceivers (PUNCH)
Packaging of novel Ultra-dyNamiC pHotonic switches and transceivers for integration into 5G radio access network and datacenter sub-systems.
New optical switches can speed up the backbone of our data networks. The EU-funded PUNCH project will develop a new solution for optical switching that addresses several industrial requirements, including reliable and low latency communication with guaranteed service quality, less network congestion (and data loss or delay), lower power consumption and reduced cost of transmission interfaces.
To do so, PUNCH will develop novel photonic components and corresponding interface electronics, establish scalable integration and photonics packaging processes and ICS, and manufacture different prototypes which will be demonstrated and validated in industrial 5G and data centre test-beds.
CHIPS JU – EUROPEAN ECOSYSTEM FOR GREEN ELECTRONIC (EECONE)
The EECONE – EUROPEAN ECOSYSTEM FOR GREEN ELECTRONIC is EU Chips Project involving more than 40 Partners from different European countries. The goal of the project is finding ways to reduce e-waste and increase sustainability in electronics industry in general.
Within the project AT&S is developing a Life Cycle Assessment Toolset as well as concepts to reduce the environmental footprint of PCB Manufacturing.
SFG – Multiwet Tool Infinity C+
The SFG funded project ‘Multiwet Tool Infinity C+‘ is about a flexible machine which enables the implementation of multiple wet-chemical processes on one single machine.
That flexibility is optimal for the usage of that machine for R&D applications due to several reasons.
The configuration of the equipment enables up to six different processes. That processes are typically realized on very large horizontal or vertical lines, but have been implemented on that machine in a compressed way to save space in the cleanroom facility.
The single chamber processing is optimized for sustainability and protects the environment as the consumption of chemicals and water at the rinsing is minimized.
Processes like etching of thin metal layers as well as developing and stripping of photosensitive layer are essential for the development of AT&S‘ IC Substrate technology out of Europe.
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