通过与一些世界上最著名的科研机构合作，我们一直处于行业的技术前沿，其中包括德国的弗劳恩霍夫研究所（Fraunhofer Institute），格拉茨技术大学（Graz University of Technology）、利奥本矿业大学（Montanuniversität Leoben）、Silicon Austria Labs、印度理工学院和美国弗吉尼亚理工大学等。通过大力投资以及与优秀的研究伙伴合作，我们不断巩固我们的技术领导地位，并推动电子行业未来的技术突破。
Unique System enables AT&S and customers to dive into the world of semiconductor processes
As part of its R&D line, AT&S has decided to purchase a physical thin film system “Clusterline 600” from Evatec. This new technology is used for the development of next-generation IC substrates, novel embedding concepts, heterogeneous integration, advanced packaging and FO-PLP (Fan-Out – Panel Level Packaging).
Glasses that can see, hear, and talk thanks to AI. iPhone designer Jony Ive, who is supposed to develop a new AI device together with OpenAI and an investment of billions: Generative artificial intelligence will influence the shape of future hardware.
New technologies developed by AT&S will soon allow network operators to utilize smaller base stations that can provide faster data transmission and lower latency while using less power. These breakthroughs will enable the upcoming 6th generation of mobile networks, finally fulfilling the promise of mobile broadband internet even in very crowded places.