活动载入中

An international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The conference is an important forum for knowledge exchange and offers numerous technical and social opportunities as well as the chance to meet leading experts from AT&S.

明细:

开始:
13. 3 月 2023
结束:
15. 3 月 2023
活动分类:
网址:
https://www.imaps.org/device_packaging_conference.php

分享活动: