高散热 印制电路板
优秀的热管理为电子产品提供保护
现代电子系统的空间越来越小，复杂性却越来越高。这可能导致其中产生大量热量的电路出现问题。在奥特斯，我们为这类应用提供高散热PCB产品。这些PCB产品可以高效地散热，防止电子电路和元件过热。我们管理废热的各种方案可以单独使用，也可以结合使用。
产品优点一览
- 使产生大量热量的元件可以直接集成到印制电路板中。
- 特定点的热得到适宜的冷却，同时热量从印制电路板顶部有效地流向底部。
自动驾驶车辆和照明
在自动驾驶汽车的激光传感器、电动汽车的电力电子设备等系统中，或在某些车辆的前灯中，都可能出现高热负荷状况。基于LED灯的现代照明概念和由可充电电池供电的设备也需要能够尽可能有效散热的电子电路。
As part of an EU research project, AT&S is developing the next generation of miniaturized inductors that can be integrated into multi-layer printed circuit boards. This makes it possible to implement the smallest voltage converters or ultra-thin, wireless charging devices, which have several advantages compared to the technology currently available.
While the discussion about a mandatory date for the introduction of e-cars is still ongoing in Europe, Norway shows that this is probably superfluous: Recently, more than 70 percent of all cars were already electrically powered.
For vehicles to operate as autonomously as possible in the future they must meet completely new requirements in data processing and sensor technology. Cutting edge technology by AT&S enables high-resolution scanning of the surroundings as well as processing and transferring the data volume incurred.
任何应用的散热
热通孔
直通连接不使用铜来导电，或不完全使用铜来导电，而主要将铜用于散热，这是印制电路板的标准热管理方法。通过精良的技术，这些被称为“热通孔”的连接可以更密集地封装在一起，这可以显著改善印制电路板上电子系统的热管理。热通孔还可以与其它技术联用，如，用于高散热印制电路板的镶嵌。
镶嵌
在奥特斯，我们拥有将铜部件集成到印制电路板中的专业术知识。这些镶嵌金属使热量可以在特定点被吸收，然后在PCB底部释放。它们被广泛应用于汽车前灯、自动驾驶汽车的激光传感器和电动汽车的充电电子设备等。它们使产生大量热量的元件可以直接集成到电路板中，进一步减少了LED元件和其它应用所需的空间。这使汽车制造商和其他电子系统生产商在设计零部件方面有更多自由空间。
绝缘金属基板
另一种处理热量积聚的方法是给整个印制电路板加一个金属基板。也就是，将基板材料镶嵌一层1.6毫米的铝或铜来吸收热量，然后通过尽可能大的表面积将热量释放到周围空气中或安装在PCB底部的散热器中。
这种基板材料的核心特征是电绝缘介电层，它可以防止信号传导层和吸热金属层之间不必要的电接触。由于混合了不同的成分（主要是陶瓷），电介质层也有很高的导热性。这种系统用于LED照明系统和电力电子设备中，用于控制电池充电。
技术数据
| Product Characteristics | Specifications |
|---|---|
| Layer Count | Aluminium: Single sided Copper: Single sided to 5 layers |
| PCB Thickness | Aluminium: 1 or 1.6 mm Copper: 1 mm |
| Thermal Conductivity | 0.4 – 5 W/mK |
| Min. Line | Spacing: 150/150 µm |
| Smallest Drill | 1.50 mm |
| Product Characteristics | Specifications |
|---|---|
| Layer Count | 4 layers and more |
| Thermal Conductivity of Copper Inlay | 360 – 390 W/mK |
| Inlay Thickness | 0.6, 0.8 or 1 mm |
| Inlay Dimensions | min. 10 x 10 mm |
| Spacing between Inlays | min. 6 mm |
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